| 标题 | 和申请材料一起寄出信件 |
| 范文 | 和申请材料一起寄出信件 和申请材料一起寄出信件Beijing University Beijing,100084 P.R. CHINA October 22, 1997 Dear Sir/Madam: I wish to apply for and financial aids to your Graduate School to pursue a Master’s degree in Materials Science and Engineering. My intended date of entry is Fall, 1998. Enclosed please find: (1) A completed application form and application fee; (2) Official transcripts from Beijing University; (3) RESUME and PURPOSE STATEMENT; (4) Letters of recommendation. Furthermore, I have requested the reference, I am enclosing photocopies of my TOEFL and GRE scores. Thank you very much in advance for you immediate action to process my application. Sincerely yours. 和申请材料一起寄出的Cover Letter Annie Wang P.O. Box 8740 Beijing 100084 P.R. CHINA October 22, 2001 Dear Sir / Madam: I am applying for acceptance and financial aid in a bid to pursue a Master’s Degree in Materials Science and Engineering at your university. My intended date of enrollment is the beginning of September 2002. Enclosed hereinwith are: (1) a completed application form; (2) the application fee by way of an in 1 2 |
| 随便看 |
|
范文大全网提供教案、简历、作文、工作总结等各类优秀范文及写作素材，是综合性免费范文平台。